
New Negative Photosensitive Polyimide Designed for 5G and Next-Gen Devices
A negative photosensitive polyimide developed by Toray Industries maintains the characteristic thermal resistance, mechanical properties, and adhesion of the material while increasing resolutions and enabling high-definition pattern formation on 100-micrometer and other thick films. To accommodate the increased speed and capacity of 5G and 6G networks, smartphones and other mobile devices will require more miniaturized electronic components and higher density mountings. This will necessitate more refined fabrication processes for the insulating…